Difference between revisions of "Bill Millerski"

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{{staff|{{PAGENAME}}
 
{{staff|{{PAGENAME}}
|position  = Equipment Engineer
+
|position  = Senior Equipment Engineer
 
|room = 1109F
 
|room = 1109F
|phone = (805) 893-2655
+
|phone = (805) 839-2655  
|cell =
 
 
|email = wmillerski@ucsb.edu
 
|email = wmillerski@ucsb.edu
 
}}
 
}}
=About=
+
= About =
 +
.
  
=Current Work=
+
.
 +
 
 +
.
  
 
=Tools=
 
=Tools=
Bill Millerski is in charge of the following tools:
+
{{PAGENAME}} is the supervisor for the following tools.  
{{tool|{{PAGENAME}}
 
|picture=FlexAL.jpg
 
{{tool|{{PAGENAME}}
 
|type = Vacuum Deposition
 
|super= Bill Millerski
 
|phone=(805)839-2655
 
|location=Bay 2
 
|email=wmillerski@ucsb.edu
 
|description = Oxford FlexAL Atomic Layer Deposition
 
|manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies]
 
|materials =
 
|toolid=6
 
}}
 
  
 
{|
 
{|
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* [[Stepper 2 (AutoStep 200)]]
 
* [[Stepper 2 (AutoStep 200)]]
 
* [[Ion Beam Deposition (Veeco NEXUS)]]
 
* [[Ion Beam Deposition (Veeco NEXUS)]]
 +
* [[RIE 5 (PlasmaTherm)]]
 +
* [[Rapid Thermal Processor (AET RX6)]]
 +
* [[Rapid Thermal Processor (SSI Solaris 150)]]
 +
* [[Step Profilometer (KLA Tencor P-7)]]
 +
* [[Chemical-Mechanical Polisher (Logitech)]]
 +
||
 +
* [[XeF2 Etch (Xetch)]]
 +
* [[Mechanical Polisher (Allied)]]
 +
* [[Tube Furnace Wafer Bonding (Thermco)]]
 +
* [[E-Beam 1 (Sharon)]]
 +
* [[Resistivity Mapper (CDE RESMAP)]]
 +
* [[Optical Film Thickness (Nanometric)]]
 +
* [[Vapor HF Etch]]
 +
* [[Wafer Bonder (Logitech WBS7)]]
 
|}
 
|}

Latest revision as of 08:28, 28 October 2021