Latest revision as of 08:28, 28 October 2021

Bill Millerski

About

.

Bill Millerski is the supervisor for the following tools.

@@ Line 1: / Line 1: @@
 {{staff|{{PAGENAME}}
-|position  = Equipment Engineer
+|position  = Senior Equipment Engineer
 |room = 1109F
-|phone = (805) 893-2655
+|phone = (805) 839-2655
-|cell =
 |email = wmillerski@ucsb.edu
 }}
-=About=
+= About =
+.
+.
-=Current Work=
+.
 =Tools=
-Bill Millerski is in charge of the following tools:
+{{PAGENAME}} is the supervisor for the following tools.
-{{tool|{{PAGENAME}}
-|picture=FlexAL.jpg
-|type = Vacuum Deposition
-|super= Bill Millerski
-|phone=(805)839-2655
-|location=Bay 2
-|email=wmillerski@ucsb.edu
-|description = Oxford FlexAL Atomic Layer Deposition
-|manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies]
-|materials =
-|toolid=6
-}}
 {|
@@ Line 32: / Line 22: @@
 * [[Stepper 2 (AutoStep 200)]]
 * [[Ion Beam Deposition (Veeco NEXUS)]]
+* [[RIE 5 (PlasmaTherm)]]
+* [[Rapid Thermal Processor (AET RX6)]]
+* [[Rapid Thermal Processor (SSI Solaris 150)]]
+* [[Step Profilometer (KLA Tencor P-7)]]
+* [[Chemical-Mechanical Polisher (Logitech)]]
+||
+* [[XeF2 Etch (Xetch)]]
+* [[Mechanical Polisher (Allied)]]
+* [[Tube Furnace Wafer Bonding (Thermco)]]
+* [[E-Beam 1 (Sharon)]]
+* [[Resistivity Mapper (CDE RESMAP)]]
+* [[Optical Film Thickness (Nanometric)]]
+* [[Vapor HF Etch]]
+* [[Wafer Bonder (Logitech WBS7)]]
+|}