Difference between revisions of "Bill Millerski"
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(Add Page for Bill Millerski) |
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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− | |position = Equipment Engineer |
+ | |position = Senior Equipment Engineer |
|room = 1109F |
|room = 1109F |
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− | |phone = (805) |
+ | |phone = (805) 839-2655 |
− | |cell = |
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|email = wmillerski@ucsb.edu |
|email = wmillerski@ucsb.edu |
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}} |
}} |
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− | =About= |
+ | = About = |
+ | . |
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+ | . |
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− | =Current Work= |
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+ | |||
+ | . |
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=Tools= |
=Tools= |
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− | + | {{PAGENAME}} is the supervisor for the following tools. |
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+ | |||
− | * |
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+ | {| |
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+ | |- valign="top" |
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+ | | |
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+ | * [[Atomic Layer Deposition (Oxford FlexAL)]] |
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+ | * [[Stepper 1 (GCA 6300)]] |
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+ | * [[Stepper 2 (AutoStep 200)]] |
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+ | * [[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | * [[RIE 5 (PlasmaTherm)]] |
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+ | * [[Rapid Thermal Processor (AET RX6)]] |
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+ | * [[Rapid Thermal Processor (SSI Solaris 150)]] |
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+ | * [[Step Profilometer (KLA Tencor P-7)]] |
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+ | * [[Chemical-Mechanical Polisher (Logitech)]] |
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+ | || |
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+ | * [[XeF2 Etch (Xetch)]] |
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+ | * [[Mechanical Polisher (Allied)]] |
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+ | * [[Tube Furnace Wafer Bonding (Thermco)]] |
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+ | * [[E-Beam 1 (Sharon)]] |
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+ | * [[Resistivity Mapper (CDE RESMAP)]] |
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+ | * [[Optical Film Thickness (Nanometric)]] |
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+ | * [[Vapor HF Etch]] |
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+ | * [[Wafer Bonder (Logitech WBS7)]] |
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+ | |} |
Latest revision as of 08:28, 28 October 2021
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About
.
.
.
Tools
Bill Millerski is the supervisor for the following tools.