Difference between revisions of "Automated Coat/Develop System (S-Cubed Flexi)"
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(indicated which PR's/chems are availabelf for general use) |
(link to recipes table) |
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''This Tool is now available for training - please contact the supervisor. 2022-11-01'' |
''This Tool is now available for training - please contact the supervisor. 2022-11-01'' |
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| − | =About= |
+ | ==About== |
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity. |
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity. |
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At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use. |
At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use. |
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| − | =Detailed Specifications= |
+ | ==Detailed Specifications== |
*Wafer Size: 100mm (150mm possible but not set up) |
*Wafer Size: 100mm (150mm possible but not set up) |
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**< 100 particles on 100mm wafer |
**< 100 particles on 100mm wafer |
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*Photoresists/Underlayers Available: |
*Photoresists/Underlayers Available: |
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| − | **UV6-0.8 |
+ | **UV6-0.8 |
**DS-K101-304 |
**DS-K101-304 |
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**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>''' |
**PMMA - '''<u>NOT FOR PUBLIC USE AT THIS TIME</u>''' |
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**AZ 300 MiF - '''<u>NOT FOR GENERAL USE AT THIS TIME</u>''' |
**AZ 300 MiF - '''<u>NOT FOR GENERAL USE AT THIS TIME</u>''' |
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| − | =Process Information= |
+ | ==Process Information== |
*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]]) |
*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]]) |
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*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists. |
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists. |
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| − | =Operating Procedures= |
+ | ==Operating Procedures== |
**[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only. |
**[[S-Cubed Flexi - Operating Procedure|Standard Operating Procedure]] - For running pre-written recipes only. |
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| + | |||
| + | == Recipes == |
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| + | '''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes. |
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Revision as of 14:41, 8 November 2022
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This Tool is now available for training - please contact the supervisor. 2022-11-01
About
The S3-Coater is a Coater/Developer system that has one photoresist spinner, one developer spinner and 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from one of 2 cassettes, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low particle counts/streaks and high uniformity.
At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.
Detailed Specifications
- Wafer Size: 100mm (150mm possible but not set up)
- PR Coating Properties:
- Uniformity < 1.0%
- < 100 particles on 100mm wafer
- Photoresists/Underlayers Available:
- UV6-0.8
- DS-K101-304
- PMMA - NOT FOR PUBLIC USE AT THIS TIME
- PMGI SF11 - NOT FOR GENERAL USE AT THIS TIME
- PMGI SF5 - NOT FOR GENERAL USE AT THIS TIME
- Solvents Available:
- EBR100 (wafer backside cleaning)
- Developers Available:
- AZ 300 MiF - NOT FOR GENERAL USE AT THIS TIME
Process Information
- Recipe Page for S-Cubed Coater: Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi)
- See the Photolith. Chemicals page for info on the installed resists.
Operating Procedures
- Standard Operating Procedure - For running pre-written recipes only.
Recipes
Recipes > Lithography > Automated Coater Recipes - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.