ASML 5500 Mask Making Guidelines

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Revision as of 15:02, 21 February 2018 by John d (talk | contribs) (copied Mask Making Guidelines PDF & inserted illumination field schematic)
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  1. Use professional mask/reticle houses: Photronics, Toppan, Compugraphics, etc. Instruct vendor that this will be used on an ASML 5500/300 system. They have all outer templates for the mask that match our system. You just provide them the data you want printed at wafer scale (1X).
  2. Reduction is 4X in ASML, mask makers will scale data to 4X size, which will determine price. Scale your mask critical dimensions and tolerances accordingly.
  3. Masks must be Quartz, should be 0.25” thick.
  4. Layer-to-layer alignment marks are provided by a calibration mask in our system. No need to put alignment marks on your mask.
     Schematic of lens/aperture illumination
  5. Field Sizes Available (Wafer Scale, 1x):
    1. The full field useable exposure area is limited to the intersection of a 31mm diameter circle and a rectangle of dimensions 22mm x 27mm. See the schematic below for an illustration.
    2. For High Resolution 0.63 NA: 21mm in X, 21mm in Y
    3. For 0.4 to 0.57 NA: 22mm in X, 22mm in Y
    4. Other rectangular sizes available, that fit within the lens/aperture intersection:
      1. 21mm x 23mm
      2. 20mm x 24mm
      3. 19mm x 25mm
      4. 18mm x 25.5mm
      5. 17mm x 26mm
      6. 16mm x 26.5mm
      7. 15mm x 27mm
    5. In general, 250nm resolution will resolve over the entire field. Anything smaller than this may not resolve closer the edges of the field where lens quality degrades, and will also have a smaller viable process window (tolerance of exposure/bake/develop parameters).
  6. Spacing between fields : 1mm of Chrome between fields (at wafer scale) in order to blank off unwanted areas.